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The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

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Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.

Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.